Flame retardant Copper-clad Polyimide film
It consists of PI film clad copper by coating adhesive. Different cooper and PI film utilized to meet the special needs of customers.
Base film Polyimide film 0.0125mm,0.025mm 0.05mm etc.
Copper foil Coffee copper 0.012mm,0.018mm,0.035mm,0.07mm etc.
Pink copper 0.012mm, 0.018mm, 0.035mm,0.07mm etc.
Adhesive Modified epoxy adhesive translucence 0.0125~0.017mm etc.
Laminate structure: Single side or double sides.
2.Application and features:
It is widely used in the data communication, aerospace, defense, personal computer and automotive fields. It processes following features:
1) High bond strenght and excellent electircal properties and good dimensional stability.
2)Excelletn solderability, good chemical resistant to process chemical and solvents.
1)Recommended storage condition: Temperature 20 c to 30c
2)Excessive exposure to heat and moisture may cause cooper oxidation