Flame retardant release film -clad Polyimide film
It consists of PI film coating adhesive clad release film. Different thickness PI film,adhesive and release film utilized to meet the special needs of customers.
Base film Polyimide film 0.0125mm,0.025mm 0.05mm etc.
Release film PP film 0.05mm
Release paper cover PE in double sides and release on one side
Adhesive Acrylic adhesive translucence thickness 0.0125~0.05mm etc.
Some special can be discussed.
2.Application and features:
It is widely used in flexibleprinted circuits board of PI film as coverlay. It processes following features:
1) Good electrical property, high bond strength and excellent dimensional stability.
2)Low flow system that minimizes adhesive squeeze-out.
Recommended storage condition: Temperature 20 c to 30c,maximum relative humidity 75%.